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M: Metallphysik

M 20: Intermetallische Phasen I

M 20.5: Vortrag

Samstag, 5. März 2005, 10:15–10:30, TU H2038

Characterization of Cu/Sn and Cu/SnPb solder reaction — •Jens Görlich and Guido Schmitz — Institut für Materialphysik, Wilhelm-Klemm-Straße 10, 48149 Münster

Development of leadfree solders and a further size reduction in electronic devices require a better understanding of physical mechanisms during soldering. Diffusion paths, kinetic processes and - especially for microdevices - the unfavorable fast growth of the non planar intermetallic Cu6Sn5 layer during the interreaction between solid Cu and liquid tin-lead or pure liquid tin solder have been investigated. SEM analyses revealed a time dependence of the scallop-like Cu6Sn5 intermetllic layer of R∼t1/3. The interfaces between Cu and the solder were analysed by HREM and EELS and the wetting angles for pure tin and tin-lead solder were determined. The growth of the scallop like structure is controlled by grain boundary diffusion across the existing Cu6Sn5 layer. Nevertheless, the observed process may be still described by a recent model [1], which assumes the transport through channel of liquid solder. Furthermore, the influence of a sputter-deposited Cu6Sn5 base metallization was investigated. The results will be discussed in view of the technologically desired limitation of the fast growth of Cu6Sn5.

[1] A.M. Gusak, Phys. Rev. B 66, 115403 (2002)

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DPG-Physik > DPG-Verhandlungen > 2005 > Berlin