Dresden 2006 – wissenschaftliches Programm
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O: Oberflächenphysik
O 4: Nanostructures I
O 4.4: Vortrag
Montag, 27. März 2006, 12:00–12:15, PHY C213
Direct Growth of Mesoscopic Copper Wires by Electrodeposition — •Sheng Zhong1,2, Thomas Koch1,2, Harald Roesner2, Horst Hahn2, Eberhard Nold3, Torsten Scherer2, Mu Wang4, Stefan Walheim2, and Thomas Schimmel1,2 — 1Institute of Applied Physics, University Karlsruhe, D-76128 Karlsruhe, Germany — 2Institute of Nanotechnology (INT), Forschungszentrum Karlsruhe, D-76021 Karlsruhe, Germany — 3Institute for Materials Research I (IMF I), Forschungszentrum Karlsruhe, D-76021 Karlsruhe, Germany — 4National Laboratory of Solid-State Microstructures, Nanjing University, Nanjing 21009, China
One-dimensional metallic nanowires have attracted considerable attention in recent years because of their potential use as interconnects in future generations of nanometer-scale electronics. For example, in the field of interconnects in electronics especially copper plays an important role. There are few methods to fabricate nanowires that are long, aligned, free standing and metallic. One of the most successful approaches to prepare metallic nanowires is the deposition of metal guided by appropriate templates. In this paper, a new method is demonstrated to self-assemble long, straight, free-standing and thin copper wires consisting of well-orientated single crystalline domains. The wires are directly reduced from copper sulfate solution in the presence of a direct current electric field without templates, surfactants and additives. We present a detailed study of the structure of these thin copper wires with a diameter down to 120 nm by SEM, FIB, TEM and SAMS.