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DS: Fachverband Dünne Schichten

DS 16: Focus Session: Sensoric Micro and Nano-systems II

DS 16.6: Vortrag

Dienstag, 1. April 2014, 15:30–15:45, CHE 89

Rolled-up antenna for on-chip aplication — •Dmitriy D. Karnaushenko, Daniil Karnaushenko, Denys Makarov, and Oliver G. Schmidt — Institute for Integrative Nanosciences, IFW Dresden, Helmholtzstraße 20, Dresden, Germany.

One of the severe limitations of the conventional inter- or intra-chip communication is the emergent parasitic reactance and resistance associated with interconnects at high frequencies, which prohibits further miniaturization of the functional elements. This issue can be overcome by wireless transceivers integrated directly on a chip [1]. The latter requires development of compact antennas with tunable emitting characteristics.

To achieve this goal, we realized helical antennas using rolled-up nanotechnology allowing straightforward on-chip integration. First, we performed full scale modeling to understand the impact of geometrical parameters on the antenna performance (gain, resonance frequency, directivity). Relying on the results of the simulations, we applied thin film deposition and lithography techniques to determine various 2D sample layouts, which are then successfully rolled-up into a 3D helical antenna. Measurements of the return loss characteristics up to 20 GHz demonstrate that the rolled-up antenna reveals better performance than the initial planar structure. Experimental data agrees well with the result of the simulations.

[1] T. Kikkawa, Microelectronic Eng. 88, 767 (2011).