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Regensburg 2016 – scientific programme

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O: Fachverband Oberflächenphysik

O 72: Solid-Liquid Interfaces: Reactions and Electrochemistry

O 72.2: Poster

Wednesday, March 9, 2016, 18:15–20:30, Poster A

Laterally varying electrochemical deposition of solid copper on magnetically patterned exchange bias templates — •Iris Koch1, Florian Ahrend1, Timo Ueltzhöffer1, Svetlana Ivanovna Shevtsova2, Philipp Martin Reintanz1, Ulrich Siemeling1, and Arno Ehresmann11Institute of Physics and Center for Interdisciplinary Nanostructure Science and Technology (CINSaT), University of Kassel, Heinrich-Plett-Str. 40, D-34132 Kassel — 2Research Institute of Physics, Southern Federal University, Stachki Ave. 194, RUS-344090 Rostov-on-Don

The inhomogeneous magnetic field landscape above magnetically patterned exchange bias (EB) systems [1] was utilized to influence the electrochemical reaction between a copper sulfate solution and a tantalum layer in a laterally anisotropic way. Thus, a local change of the copper deposition rate due to the specially designed magnetic stray fields acting on the paramagnetic Cu2+ ions is initiated. For process optimization, parameters like ion concentration, deposition time, and tantalum layer thickness were varied and analyzed by optical microscopy and energy dispersive x-ray spectroscopy. In all of the performed experiments, a significant influence of the EB system’s magnetic pattern and, therefore, surface properties on the electrochemical reaction could be observed. This novel concept appears to be a promising method for the controlled growth of metallic nanowires.

[1] F. Ahrend et al., J. Magn. Magn. Mater. 381, 292 (2015)

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