Berlin 2018 – scientific programme

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KFM: Fachverband Kristalline Festkörper und deren Mikrostruktur

KFM 23: Lithography III: Lithography and Structuring (joint session KFM/DS)

KFM 23.4: Talk

Thursday, March 15, 2018, 10:40–11:00, EMH 025

Innovations in photoresists and photopolymers for 2D / 3D micro and nano fabrication — •Anja Voigt, Christine Schuster, Jan Klein, Arne Schleunitz, and Gabi Grützner — micro resist technology GmbH, Koepenicker Str. 325, 12555 Berlin, Germany

Different methods for the manufacture of high resolution 2D and 3D features require a wide range of material solutions based on innovative photoresists and photopolymers. As a commercial resist supplier, micro resist technology aims at providing such solutions tailored for diverse lithography processes, comprising both materials and technology support. The following highlights will be presented:

E-beam lithography is a versatile patterning method for the generation of high resolution nano-patterns. Combining stepwise greyscale exposure and pattern reflow with a positive tone resist results in greyscale patterns of small dimensions.

Greyscale UV lithography of up to 100 micron thick resist films, either by direct laser writing or by conventional mask aligner exposure and a greyscale mask, can generate very deep greyscale micro-patterns. Both very thick films, and considerably smaller pattern features including sharp tips have been successfully fabricated using this technique.

Laser interference lithography is another method which allows the manufacture of nanoscale patterns * periodic patterns even on very large substrates. Whereas two photon absorption (2PA) allows the generation of real 3D patterns at micro and nanoscale.

The development of photoresist and photopolymer materials tailored to meet the requirements of the specific technologies will be presented.