Würzburg 2018 – scientific programme

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T: Fachverband Teilchenphysik

T 5: Pixel-Detektoren I

T 5.5: Talk

Monday, March 19, 2018, 17:00–17:15, Philo-HS5

A 65 nm pixel readout chip in 65 nm process with passive CMOS sensor — •Daniel Coquelin, Michael Daas, Tomek Hemperek, Fabian Hügging, Hans Krüger, David-Leon Pohl, Mark Standke, and Norbert Wermes — Nussallee 12, 53115 Bonn

For the high luminosity LHC the ATLAS detector must be upgraded. The tracking detector will be an all silicon tracker with several layers of hybrid pixel detectors. In view of this upgrade, a pixel readout chip in 65 nm TSMC CMOS process was developed (FE65-p2). It consists of 64x64 pixels with a pitch of 50 x 50 um. A passive CMOS sensor from Lfoundry in 130 nm CMOS process with small 50 x 50 um pixels and a bulk resistivity of 4-5 kOhm-cm is bump bonded to the readout chip. The prototype sensor is characterized using IV curves, threshold measurements, as well as electron and X-ray sources.