Regensburg 2019 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

MM: Fachverband Metall- und Materialphysik

MM 24: Topical session (Symposium MM): Correlative and in-situ Microscopy in Materials Research

MM 24.1: Topical Talk

Mittwoch, 3. April 2019, 10:15–10:45, H45

Correlating electrical and mechanical behaviour of polymer supported metal thins with in-situ methods — •Megan J. Cordill — Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria

Ductile films and lines are an integral part of flexible electronics because they allow current flow between semiconducting islands and other operating features. However, the charge carrying ductile films must be of an optimum thickness and microstructure for suppression of cracking when tensile loading is applied. Studies of strained films on polymer substrates tend to emphasize only the electrical properties and thickness effects more than the role of film microstructure or deformation behavior. To address both the electro-mechanical and deformation behavior of metal films supported by polymer substrates, in-situ resistance measurements were performed with in-situ confocal scanning laser microscopy imaging of the film surface during cycling. The resistance measurements allow for the examination of the changes in resistance with strain, while the surface imaging permits the visualization of localized thinning and crack formation. Furthermore in-situ synchrotron tensile tests provide information about the stresses in the film and show the yield stress where the deformation initiates and the relaxation of the film during imaging. The combination of electrical measurements, surface imaging, and stress measurements allow for a complete picture of electro-mechanical behavior needed for the improvement and future success of flexible electronic devices.