Bonn 2020 – wissenschaftliches Programm
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T 82.9: Vortrag
Donnerstag, 2. April 2020, 18:30–18:45, L-2.004
Testbeam results of ATLASPix3 — H. Augustin1, F. Ehrler2, D.M. Immig1, •D. Kim1, L. Mandok1, L.O.S. Noehte1, I. Perić2, M. Prathapan2, T.T. Rudzki1, R. Schimassek1, A. Schöning1, A. Weber1,2, and H. Zhangh2 — 1Physikalisches Institut, Uni Heidelberg — 2Karlruher Institut für Technologie
For the high luminosity upgrade at the Large Hadron Collider (HL-LHC) ATLAS will replace its tracking system with the Inner Tracker fully made of silicon detectors. The instantaneous luminosity, that increases by 5-7 times with respect to the current LHC value, causes challenges in terms of radiation tolerance and readout speed. An alternative to the hybrid detectors of the outer pixel modules are High-Voltage Monolithic Active Pixel Sensors (HV-MAPS).
HV-MAPS combines the fast charge collection via drift of the active pixel matrix with a fully integrated readout structure in one entity. ATLASPix3 is an HV-MAPS prototype based on HV-CMOS 180nm technology and was produced with a substrate resistivity of the wafer of 200 Ω cm. In ATLASPix3, an NMOS comparator is embedded in the pixels. The pixel matrix consists of 132 columns and 372 rows with a pixel size of the ATLASPix3 is a pixel size of 150 x 50 µ m2.
This talks presents first testbeam results of ATLASPix3, including the efficiency and time resolution, as measured with MuPix telescope.