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K: Fachverband Kurzzeit- und angewandte Laserphysik
K 5: Laser Systems and Laser Applications
K 5.5: Vortrag
Mittwoch, 11. März 2020, 12:00–12:15, f428
Magnetic field-assisted laser ablation of silicon — Falicienne G. Keabou1, Garik Torosyan1, •Yiyun Kang1, Hicham Derouach1, Xavi del Arco2, Pavel Terekhin2, Mareike Schäfer1, Bärbel Rethfeld2, and Johannes A. L’huillier1 — 1Photonik-Zentrum Kaiserslautern e.V., 67633 Kaiserslautern, Germany and Research Center OPTIMAS, TU Kaiserslautern, 67663 Kaiserslautern, Germany — 2Department of Physics and Research Center OPTIMAS, Technische Universität Kaiserslautern, 67663 Kaiserslautern, Germany
Laser micromachining is an enabling technology for numerous applications. A well-controlled ablation process is often crucial for a certain application. Only the temporal and spatial pulse separation as well as the pulse energy and pulse duration are in the sphere of influence of the experimentalists. After applying the ultra-short laser pulse to the surface virtually no control is possible. A new, highly promising approach to achieve a deeper control is to apply an external magnetic field parallel to the laser beam axis during laser ablation. The magnetic field allows for a stronger absorption of the pulses in the excited area of the medium, shall provide a local confinement for the hot electrons and may influence the plasma. In this study, a static magnetic field up to 233 mT is applied during multi-pulse ablation and by processing cavities on silicon for short as well as ultrashort laser pulses. An enhancement of ablation depth and a clean processed and well defined shape is achieved. A first theoretical model analyzing the energy distribution of heated electrons is developed.