SKM 2021 – wissenschaftliches Programm
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CPP: Fachverband Chemische Physik und Polymerphysik
CPP 6: Poster Session II
CPP 6.26: Poster
Dienstag, 28. September 2021, 17:30–19:30, P
Thermal transport of epoxy networks: Bond engineering and network microstructures — •Manjesh Kumar Singh1 and Debashish Mukherji2 — 1Department of Mechanical Engineering, Indian Institute of Technology Kanpur, Kanpur: 208016, Uttar Pradesh, India — 2Quantum Matter Institute, University of British Columbia, Vancouver BC V6T 1Z4, Canada
Thermal transport coefficient (k) is a central property of condensed matter systems, where establishing the molecular level understanding is extremely important to tailor the materials properties for their possible uses under extreme environmental and practical conditions. Here polymers are an important class of materials because they provide different pathways for the energy transfer. For example, the heat flow between the two covalently bonded monomers is over 100 times faster than between the two non-bonded monomers [1]. Therefore, the delicate balance between these two contributions often provides a guiding tool for the design of tailor made polymeric materials with extraordinary thermal properties. Traditionally most studies have investigated k in the linear polymeric materials, the recent interests have also been directed towards the epoxy network. Using molecular dynamics simulations, we investigate the factors effecting k of epoxy networks. We emphasize on the importance of the bond types and their influence on the network microstructures, with a goal to provide a guiding principle for the tunability in k [2].
[1] Bhardwaj et al., ACS Nano 15, 1826 (2021). [2] Mukherji et al., Physical Review Materials 5, 025602 (2021).