Regensburg 2022 – wissenschaftliches Programm
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DY: Fachverband Dynamik und Statistische Physik
DY 46: Poster Session: Complex Fluids, Soft Matter, Active Matter, Glasses and Granular Materials
DY 46.10: Poster
Donnerstag, 8. September 2022, 15:00–18:00, P2
Non-mechanical Electrowetting Pump On a Chip — •Sebastian Bohm1,2, Hai Binh Phi2, Lars Dittrich2, and Erich Runge1 — 1Technische Universität Ilmenau, Theoretische Physik 1, Weimarer Str. 25, 98693 Ilmenau — 25microns GmbH, Ehrenbergstr. 11, 98693 Ilmenau
Numerical simulations suggests that by using the EWOD (electrowetting-on-dielectric) effect a micropump can be manufactured, that works completely without any moving components [1,2]. The volume stroke is generated by the periodic movement of liquid-vapor interfaces in a large number (≈ 106) of microcavities (Δ V≈ 1 pl per cavity). Passive Tesla-Diodes are used to rectify the resulting volume stroke to completely forgo any moving parts. Even though our simulation suggests a high efficiency comparable to that of conventional designs in particular for small pumps, the actual realization poses multiple challenges. In this work, first experimental results of the characterization of the micropump are presented. The manufacturing process is described, which is based on an smart combination of processes commonly used in microsystems technology. This enables a cost-effective manufacturing that can be carried out entirely on wafer level. In addition, the direct integration of the pump into wafer-based microfluidic or lab-on-a-chip applications is facilitated. Possible use cases are presented and discussed.
[1] Bohm, S., Dittrich, L., Runge, E.; COMSOL Conference 2020 Europe, 14-15. Oct. 2020 online
[2] Hoffmann et al.; patent DE 11 2011 104 467 (2012)