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DS: Fachverband Dünne Schichten
DS 5: 2D Materials and their Heterostructures III
DS 5.2: Talk
Tuesday, March 28, 2023, 10:00–10:15, SCH A 316
Contact Printed Micro Circuit Boards - A Novel Platform for the Defect Free Integration of 2D Materials — •Christian N. Saggau1, Sanaz Shokri1, 2, Yejin Lee1, 2, Mickey Martini1, 2, Tommaso Confalone1, Genda Gu3, Valentina Brosco4, Domenico Montemurro5, Valerii M. Vinokur6, Kornelius Nielsch1, 2, 7, and Nicola Poccia1 — 1Leibnitz Institute for Solid State and Materials Science Dresden, Dresden, Germany — 2Institute of Applied Physics, Technische Universität Dresden, Dresden, Germany — 3Condensed Matter Physics and Materials Science Department, Brookhaven National Laboratory, Upton, USA — 4Italian National Research Council, Institute for Complex Systems, Rome, Italy — 5Department of Physics, University of Naples Federico II, Naples, Italy — 6Terra Quantum AG, St. Gallen, Switzerland — 7Institute of Materials Science, Technische Universität Dresden, Dresden, Germany
The 2D cuprate superconductor BSCCO, promises upon integration with CMOS electronics, on-chip high temperature superconducting single photon detectors or quantum interference device (SQUID). Unfortunately, its properties degrade quickly if exposed to elevated temperatures, solvents, oxygen or water. Here we present Hall devices with a record thin film Tc of 91 K, which is identical to the bulk value of the crystal. Electrical contacts were established through transfer-printable circuits embedded in SiNx nanomembranes. The membrane incapsulates the material shielding it from the environment, while via contacts are used to form the electrical contacts.