SMuK 2023 – wissenschaftliches Programm

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P: Fachverband Plasmaphysik

P 1: Low Pressure Plasmas and their Application I

P 1.1: Hauptvortrag

Montag, 20. März 2023, 11:00–11:30, CHE/0089

Ion Beam Sputter Deposition -- Fundamentals and Applications — •Carsten Bundesmann — Leibniz Institute of Surface Engineering (IOM), Leipzig

There is an increasing demand for thin films with tailored properties, which requires the use and control of adequate deposition techniques. Ion beam sputter deposition (IBSD) is a PVD technique that is capable of fulfilling the technological challenges. It is based on ion-solid interaction: A low-energy ion beam (Eion ~ 2000 eV) is directed onto a target and target particles get sputtered due to energy and momentum transfer [1]. These particles condense on a substrate and a film is growing (see Fig. 1). In addition, scattered primary particles and reactive background gas particles may contribute to thin film growth. In comparison to other PVD techniques, IBSD offers a unique opportunity to tailor angular-dependent energy and flux of the film-forming particles and, hence, thin film properties by changing ion beam parameters (ion species and ion energy) and geometrical parameters (ion incidence angle and emission angle).

Using selected examples, this talk describes the systematics, including pros and cons, of IBSD: The correlation between process parameters, properties of the film-forming particles, and thin film properties. The most important process parameters are the scattering geometry and the primary particle species. Depending on the material, different film properties can be influenced. Examples are adhesion, structural properties, composition, surface roughness, mass density, optical properties, stress, and electrical resistivity.

[1] C. Bundesmann, H. Neumann, J. Appl. Phys. 124 (2018) 231102.