Dresden 2026 – scientific programme

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DS: Fachverband Dünne Schichten

DS 13: Layer Properties

DS 13.1: Invited Talk

Wednesday, March 11, 2026, 15:00–15:30, REC/B214

Tailored thermal treatments for multi-layer, multi-material polymer devices — •Katherina Haase, Shaoling Bai, Mike Hambsch, Vojtech Millek, and Stefan C. B. Mannsfeld — Faculty of Electrical and Computer Engineering & Center for Advancing Electronics Dresden (cfaed), TUD Dresden University of Technology, 01069 Dresden, Germany

Thermal annealing constitutes an important processing step during the fabrication of organic semiconductor-based devices as it removes residue solvent and often leads to improved structural order. Recently, we have explored an additional aspect of thermal annealing - its impact on the dissolution of conjugated polymer (CP) thin films. We could show that thermal annealing induces physical cross-linking in a wide range of CPs,[1] which distinctly increased their stability in the original solvent. Hence, we suggested that tailored thermal treatments could enable polymer heterojunction devices though simple sequential coating.

In this presentation, we discuss the important finding that the thermal physical cross-linking (TPC) effect produces solvent-resistant thin films for a wide variety of CPs that could be combined into a multitude of novel devices, and explore the fabrication of solution-coated, polymer heterojunction-based synaptic transistors - devices that could not have been realized without the application of cross-linking.

[1] S. Bai, K. Haase, J. Perez Andrade, M. Hambsch, F. Talnack, V. Millek, A. Prasoon, J. Liu, K. Arnhold, S. Boye, X. Feng, S. C. B. Mannsfeld, Adv. Electron. Mater. 2024, 10, 1.

Keywords: conjugated polymer; cross-linking; multi-layer; solution shearing; photo transistor