DS 3: Thin Film Properties I: Methods
Monday, March 9, 2026, 15:00–16:00, REC/C213
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15:00 |
DS 3.1 |
Update on the IBA activities in Bonn — •Henry Schumacher, Dennis Sauerland, and Sebastian Neubert
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15:15 |
DS 3.2 |
The TXPES Beamline at SESAME: A New Facility for Advanced Soft X-ray Photoelectron Spectroscopy — •Zeynep Reyhan Ozturk
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15:30 |
DS 3.3 |
Bringing Synchrotron-Level HAXPES to the Lab: DeepCore-X for Buried Interface Characterization — •Martin Schmid, Elin Cartwright, Eleni Anargirou, Marcus Lundwall, and Susanna Eriksson
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15:45 |
DS 3.4 |
Simulation-Guided GIXPS: How to Maximize Signal and Depth Sensitivity in Photoelectron Emission Experiments — •O. Rehm, E. Kusari, D. Capalbo, A. Gloskovskii, C. Schlueter, L. Baumgarten, and M. Müller
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