Dresden 2026 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

HL: Fachverband Halbleiterphysik

HL 20: Poster I

HL 20.42: Poster

Dienstag, 10. März 2026, 18:00–20:00, P1

Towards the integration of telecom C-band QDs into photonic integrated circuits — •Michelle Weiß, Ulrich Pfister, Ponraj Vijayan, Simon Oberle, Justus Unfried, Philipp Noack, Tobias Bruggesser, Sergej Vollmer, Raphael Joos, Michael Jetter, Simone L. Portalupi, and Peter Michler — Institut für Halbleiteroptik und Funktionelle Grenzflächen (IHFG), University of Stuttgart, Center for Integrated Quantum Science and Technology (IQST) and SCoPE, University of Stuttgart, Allmandring 3, Germany

Photonic integrated circuits (PICs) pave the way to the realization of several quantum technologies on a small footprint, which makes them highly desirable for applications in quantum communication, computing, simulation and sensing. Silicon and silicon nitride are leading materials for PICs due to the high quality optical components and low optical propagation losses. Due to the indirect bandgap of silicon most of the single-photon sources (SPSs) are based on probabilistic implementations. However, the probabilistic generation of the photons can limit the scalability and requires the use of high laser powers, which is a potential drawback regarding the integration of on-chip detectors. In this regard, In(Ga)As quantum dots (QDs) are promising candidates as on-demand SPSs with high single-photon purity. For their integration on low-loss PICs, several approaches already exist, like monolithic integration techniques and hybrid approaches used for interfacing with silicon-based platforms. We present the progress on various PIC integration techniques for InGaAs QDs grown on a metamorphic buffer layer and so emitting in the telecom C-band.

Keywords: PIC; InGaAs-QDs; telecom; C-band; WG