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HL: Fachverband Halbleiterphysik

HL 26: Poster II

HL 26.21: Poster

Mittwoch, 11. März 2026, 09:30–11:30, P1

How To Tame Your Iodine in Reactive Sputtering and Similar UHV Thin Film Deposition Processes — •Christiane Dethloff, Sebastian Köpp, Sofie Vogt, Lukas Trefflich, Holger von Wenckstern, and Marius Grundmann — Felix-Bloch-Institute for Solid State Physics, Universität Leipzig, Germany

Sputtering in reactive atmospheres involves several challenging conditions, like target poisoning, or a hysteresis of the reactive gas partial pressure, leading to an unstable operation regime [1]. In order to investigate and control these process conditions, and therefore tune the properties of the resulting thin film, a controlled flux of the reactive species is crucial. Commonly, this is achieved by mass flow controllers, when O and N are the reactive gases [2]. However, in the case of an iodine enriched atmosphere this is hardly feasible, due to the corrosive effect and low inlet pressures.
We present an optical measurement setup, enabling real-time measurements of the iodine content in an iodine enriched Ar flow from an iodine vaporizer into a deposition chamber. Our investigations comprise the growth and characterization of functional p-type copper iodide (CuI) thin films by reactive magnetron sputtering under a well defined iodine flux.
[1] D. Güttler et al., Applied Physics Letters 85.25 (2004): 6134−6136 DOI:10.1063/1.1835002.
[2] A. Welk, M. Grundmann et al., Physical Review Applied 17.2 (2022): 024007 DOI: 10.1103/PhysRevApplied.17.024007

Keywords: magnetron sputtering; copper iodide; iodine; process control