Dresden 2026 – scientific programme
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QI: Fachverband Quanteninformation
QI 8: Implementations III
QI 8.3: Talk
Tuesday, March 10, 2026, 14:30–14:45, BEY/0137
Realising Superconducting Qubit Architectures using Scalable Flip-Chip Integration — •Anirban Bhattacharjee1,2, Lea Richard1,2, Julius Feigl1,2, Ivan Tsitsilin1,2,3, Niklas Bruckmoser1,2, Johannes Schirk1,2, João Romeiro1,2, David Bunch1,2, Leon Koch1,2,3, Haiyang Hu1,2, Lasse Södergren1,2, Christian Schneider1,2, Max Werninghaus1,2, and Stefan Filipp1,2 — 1Technical University of Munich, School of Natural Sciences, Physics Department, Garching, Germany — 2Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, Garching, Germany — 3Peak Quantum GmbH, Garching, Germany
Flip-chip integration technologies have emerged as a promising approach to scale superconducting qubits. This enables flexible signal routing and minimizes crosstalk. Separating the qubit chip from the control chip, consisting of microwave signal lines, allows tackling fabrication challenges independently. In this work, we use high quality indium bumps for inter chip bonding and polymer spacers to achieve precise control of inter chip spacing and alignment. We demonstrate qubits exhibiting average relaxation times of T1=102 ± 13 µs and microwave resonators with quality factors of Qint ≥ 106, demonstrating that our techniques do not degrade the resonator or qubit performance. We also report our ongoing work in realizing high fidelity two-qubit gates using a tunable coupler architecture, an essential step towards scaling up superconducting quantum processors using flip-chip technologies.
Keywords: Superconducting qubits; Flip chip integration; Tunable couplers; Scaling; Quantum computation