Dresden 2026 – scientific programme
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TT: Fachverband Tiefe Temperaturen
TT 43: Superconducting Electronics: Qubits
TT 43.6: Talk
Wednesday, March 11, 2026, 10:45–11:00, CHE/0089
Low-crosstalk modular flip-chip architecture with superconducting kinetic-inductively coupled flux-qubit-resonator circuits — •Sören Ihssen1, Simon Geisert1, Gabriel Jauma2,3, Patrick Winkel1,4,5, Martin Spiecker1, Nicolas Zapata1, Manuel Pino2,7, Juan Jose Garcia-Ripoll2, and Ioan M. Pop1,6,8 — 1IQMT, Karlsruhe Institute of Technology, 76131 Karlsruhe, Germany — 2Institute of Fundamental Physics IFF-CSIC, Calle Serrano 113b, 28006 Madrid, Spain — 3Applied Physics Department, Salamanca University, Salamanca 37008, Spain — 4Departments of Applied Physics and Physics, Yale University, New Haven, CT 06520, USA — 5Yale Quantum Institute, Yale University, New Haven, CT 06520, USA — 6PHI, Karlsruhe Institute of Technology, 76131 Karlsruhe, Germany — 7Nanotechnology Group, USAL-Nanolab, Salamanca University, Salamanca 37008, Spain — 8Physics Institute 1, Stuttgart University, 70569 Stuttgart, Germany
We introduce a flip-chip architecture for arrays of coupled superconducting qubits in which each circuit component is placed inside its own microwave enclosure. Unlike conventional flip-chip designs, our qubit chips are electrically floating, enabling straightforward modular assembly of capacitively coupled elements while strongly suppressing microwave crosstalk. We demonstrate the architecture using a chain of three nearest-neighbor coupled generalized flux qubits, where the central qubit serves as a frequency-tunable coupler. This system achieves a transverse coupling on/off ratio of 50, zz-crosstalk of 0.7 kHz between resonant qubits, and >60 dB isolation between outer enclosures.