Erlangen 2026 – scientific programme

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T: Fachverband Teilchenphysik

T 30: Silicon Detectors III

T 30.9: Talk

Tuesday, March 17, 2026, 18:15–18:30, KH 01.012

All-Silicon Modules - RDL development in FTD Cleanroom — •Andreas Ulm, Marco Vogt, Hans Krüger, and Jochen Dingfelder — Physikalisches Institut der Universität Bonn, Bonn, Germany

Silicon Pixel Detectors are an essential part of most modern tracking systems for high energy physics as they can fulfill requirements of high spatial and time resolution, feasible power consumption and relatively low material budget. To cover large areas in the detector volume individual chips are glued together to create modules. These modules are easier to assemble to full tracking systems than what would be possible if all chips had to be installed individually, however gluing, additional flex PCBs, cooling and support structures and also structural silicon can introduce significant amounts of material.

To reduce the material budget of tracking detectors as far as possible, a new concept of module-building is investigated. By post-processing monolithic chip wafers, redistribution layers (RDL) can be built on top of the chips for electrical connections to several chips in a row. By using low power monolithic chips air cooling is feasible and mechanical support is not necessary for thin ladder structures of up to 15 cm in length with thicknesses around 200 micron .

This talk will discuss concepts, look into prototype production, and discuss early measurements and simulations of high speed differential lines for module-sized RDL.

Keywords: RDL; CMOS; Pixel Modules; Cleanroom