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Mainz 2026 – scientific programme

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K: Fachverband Kurzzeit- und angewandte Laserphysik

K 1: Laser Systems and their Applications I

K 1.6: Talk

Monday, March 2, 2026, 13:00–13:15, HS 20

High resolution materials processing with temporally shaped femtosecond pulsesCristian Sarpe1, Florian Fiedler1,2, Omar Elsheikh1,2, Bastian Zielinski1,2, and •Camilo Florian1,21University of Kassel, Institute of Physics and CINSaT, Heinrich-Plett-Str. 40, 34132 Kassel, Germany — 2University of Kassel, Institute of Materials Engineering, Moenchebergstr. 7, 34125 Kassel,University of Kassel, Institute of Materials Engineering, Moenchebergstr. 7, 34125 Kassel, Germany

Femtosecond laser systems are becoming the mainstream processing tool for high lateral resolution materials processing. Traditional direct write laser systems employ nominal bandwidth limited pulses that typically display Gaussian temporal profiles, which most of the time produce crater shaped modifications at the surface level in dielectric, semiconductor, and metallic materials. Advancements in temporal pulse shaping techniques have demonstrated significant improvements in the final size and depth, increasing the overall ablation efficiency and the final lateral resolution. In this work, we present a survey that includes the formation of micro and nanometric size modifications induced by temporally shaped femtosecond laser pulses generated by an amplified Ti:Sa femtosecond laser system operating at 1 kHz, 790 nm nominal wavelength, and a pulse duration of 30 fs. Five types of femtosecond pulses were implemented. The results highlight the critical role of temporal pulse shaping in controlling laser material interactions and open new pathways for high precision material processing across many disciplines and fields of application.

Keywords: temporal shaping; femtosecond; metal; semiconductor; dielectric

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