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DS: Dünne Schichten

DS 31: Postersitzung

DS 31.30: Poster

Tuesday, March 27, 2001, 16:30–17:30, Foyer Saal 4

Structure and morphology of thin Ta and TaNx films — •Tien Hung Luu, Jens Baumann, Gisela Baumann, Steffen Schulze, and Michael Hietschold — TU Chemnitz, Institute of Physics

Cu metallisation of integrated circiuts is reality today. The reliability of todays Ta based diffusion barriers for Cu however has to be shown for the shrinking device dimensions too. Therefore we have investigated the structure and morphology of these thin films with respect to different deposition parameters. For preparing samples for the electron microscopy special efforts had to be made in order to reach electron tranparency despite of the high internal stress in the films. The performed investigations enabled us to assign a found sharp decrease in resistivity to a phase change in the Ta films. Different TaNx phases could also be identified. Moreover it was found, that the films exhibit a polycrystalline structure.