Berlin 2005 – wissenschaftliches Programm
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O: Oberflächenphysik
O 15: Postersitzung (Adsorption an Oberfl
ächen, Epitaxie und Wachstum, Organische Dünnschichten, Oxide und Isolatoren, Rastersondentechniken, Zeitaufgelöste Spektroskopie, Methoden)
O 15.66: Poster
Freitag, 4. März 2005, 17:00–20:00, Poster TU D
Stack-type vibration decoupling for scanning probe applications — •F. Müller1, A.-D. Müller1, D. Billep2, St. Kurth3, A. Shaporin2, M. Hietschold1, and W. Dötzel2 — 1Chemnitz University of Technology, Institute of Physics, Solid Surfaces Analysis Group, 09107 Chemnitz — 2Chemnitz University of Technology, Faculty of Electricl Engineering and Information Technology, Microsystems and Device Technology Group, 09107 Chemnitz — 3Fraunhofer IZM, Micro Devices and Equipment, Reichenhainer Strasse 88, 09126 Chemnitz
In Scanning Tunneling Microscopy (STM), a stack of mechanically coupled metal plates is commonly used as vibration isolation to obtain atomically resolved images. In this work, the transmission of mechanical vibrations through this stack is studied in dependence on its geometrical dimensions and material properties [1, 2]. A phase sensitive correlation analysis between a defined mechanical excitation and the resulting movement of different plates in vertical and lateral directions allows to quantify the efficiency of the vibration damping in a frequency range till 200 Hz. From the characteristics obtained at the example of the Pocket STM, the typical frequency response function (FRF) of the stack is obtained. For optimization purposes, a finite element model of the device was used. Modal and transient analysis of the device were performed for various combinations of geometrical parameters and material properties. Modelling results show satisfactory similarities with the measurements taken at the STM stack.
[1] S.I. Park, C.F. Quate, Rev. Sci. Instrum. 58, 2004-2009 (1987). [2] D.W. Pohl, IBM J. Res. Develop. 30 (4), 417-427 (1986).