Dresden 2006 – wissenschaftliches Programm

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DS: Dünne Schichten

DS 24: Poster presentation

DS 24.24: Poster

Dienstag, 28. März 2006, 15:00–17:30, P2

Indentation and shear of thin fluorocarbon films on silicon substrate — •Yonghe Liu, Mikhail Kosinskiy, Vasil Yanev, Stefan Krischok, and Juergen A. Schaefer — Institut für Physik und Zentrum für Mikro- und Nanotechnologien, Technische Universität Ilmenau, 98693 Ilmenau, Germany

Deposition of a thin polytetrafluoroethylene-like fluorocarbon (FC) film on Si can reduce its adhesion to various substances including water significantly, and thus has potential applications in microelectromechanical systems. However, the adhesion of FC on Si substrate is also weak, which might lead to debonding and other damages of the films under both compression and shear. We report the indentation and shear behaviour of FC films with various thickness prepared by plasma enhanced polymerization. The measurements were performed by a microtribometer with a sphere-on-plane setup. A prescribed load was applied to a glass cantilever through which an atomically smooth Si sphere was in contact with a Si specimen covered with FC film. The normal load-displacement curves in loading and unloading were employed to study the indentation behaviour. Lateral force measured at various normal loads and strain rates were analyzed with contact models to study the shear properties. The topography of residual impression and the wear scars left by shear deformation were observed by a confocal scanning laser microscope and correlated with the indentation and shear measurements.