Bonn 2010 – wissenschaftliches Programm

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T: Fachverband Teilchenphysik

T 58: Halbleiterdetektoren I

T 58.6: Vortrag

Montag, 15. März 2010, 18:00–18:15, HG VI

Testing and Characterization of the new Pixel Front-End IC in the 3D integration technology for Upgraded LHC — •David Arutinov, Malte Backhaus, Marlon Barbero, Tomasz Hemperek, Michael Karagounis, Hans Krüger, and Norbert Wermes — Physikalisches Institut, Universität Bonn

ATLAS is a multi-purpose detector experiment operating at the LHC collider in CERN. The pixel detector being the innermost part of ATLAS provides precise particle position measurement at the nominal LHC luminosity of 10³⁴ cm⁻²s⁻¹. After upcoming upgrades, assuming increase of the luminosity up to 10³⁵cm⁻²s⁻¹, the current pixel detector will not be able to sustain new higher hit rates. Therefore a pixel Front-End (FE) with a different architecture is needed for the pixel innermost layers. CMOS technology scaling down will be pursued in parallel to so-called 3D integration techniques. This new technology gives the possibility to split IC design flow in several layers of active parts and integrate the tiers in to a single package, using Through Silicon Via, chip thinning and tier to tier bonding technique. It is widely believed that 3D integration is a future for chip design in general and could present great benefits for hybrid pixel detectors. Prototypes of the new 3D pixel FE already exist. For testing purposes of the new 3D FE prototype, an FPGA based test setup was developed together with the FPGA firmware and the software interface. The results from these developments will be presented in this talk.