Regensburg 2010 – scientific programme

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O: Fachverband Oberflächenphysik

O 2: Metal substrates: Solid-liquid interfaces

O 2.2: Talk

Monday, March 22, 2010, 11:30–11:45, H31

Effect of additives on Cu electrodeposition: an in-situ STM study — •Yuriy Yanson, Geert Wijts, Fred Schenkel, and Marcel J. Rost — Kamerlingh Onnes Laboratory, Leiden University, The Netherlands

Small amounts of specific substances, known as additives, can dramatically influence the growth of electrodeposited thin films. Although additives are often applied in the industry not only to change the film properties but also to enable a specific deposition, the microscopic (atomic) understanding of the additive influence on the growth is usually still lacking. We present an in-situ STM studies of Cu electrodeposition on the Au(111) substrate, in which we clearly show the atomic scale effect of industrially relevant additives on the growth. In particular, we discuss the influence of the accelerator bis-(3-sodiumsulfopropyl) disulfide (SPS) and the inhibitor polyethylene glycol (PEG) on Cu plating. We expect that our newly developed video-rate EC-STM will provide access to even shorter time scales enabling the study of growth dynamics.