Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

MI: Fachverband Mikrosonden

MI 3: TEM- and SEM-based Material Analysis

MI 3.1: Hauptvortrag

Montag, 14. März 2011, 14:30–15:15, BEY 81

Transmission electron microscopy of interface and defect phenomena of functional materials — •Wolfgang Jäger — Mikrostrukturanalytik, Christian-Albrechts-Universität zu Kiel

Advanced high-resolution imaging and spectroscopic techniques of electron microscopy play a crucial role in characterizing the microstructure and the structure-property relationships of inorganic materials and interfaces. The presentation will describe applications of quantitative transmission electron microscopy methods to investigations of surface and interface phenomena of nanostructured functional materials and technologically relevant layer systems. Examples are aberration-corrected high-resolution TEM of incommensurate interfaces in misfit layer compounds1, metal intercalation and formation of surface nanostructures on chalcogenide layered crystals2, electron tomography3 and interfaces4 of diffusion-induced nanoinclusions in III-V semiconductors, nanostructured oxide semiconductors5, defect engineering for high-efficiency semiconductor solar cells6, and multilayer systems for x-ray optics7.

1. M. Garbrecht, E. Spiecker et al., Ultramicroscopy (2011). 2. E. Spiecker, A. Schmid, A. Minor et al., Phys. Rev. Lett. 96, 086401 (2006). 3. Ch. Kübel, Ch. Dieker et al., Proc. 17th Int. Microscopy Congress, Rio de Janeiro, I7.30 (2010). 4. Ch. Jäger, E. Spiecker et al., Ultramicroscopy 92, 273 (2002). 5. Y. Ortega Villafuerte, Ch. Dieker et al., Nanotechnology 21, 225604 (2010). 6. J. Schöne, E. Spiecker et al., Appl. Phys. Lett. 92, 081905 (2008). 7. D. Häussler, Ch. Morawe, U. Roß et al., Surface & Coatings Technology 204, 1929 (2010).