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O: Fachverband Oberflächenphysik

O 60: Poster Session IV (Solid/liquid interfaces; Semiconductors; Oxides and insulators; Graphene; Plasmonics and nanooptics; Electronic Structure; Surface chemical reactions; Heterogeneous catalysis)

O 60.6: Poster

Wednesday, March 16, 2011, 17:30–21:00, P4

Copper electrodeposition and additives: from underpotential deposition to bulk growth — •Yuriy Yanson, Joost Frenken, and Marcel Rost — Leiden University, Leiden, the Netherlands

Cu electrodeposition at different stages on Au(111) surface is accessed in-situ on atomic scale by means of our newly developed fast electrochemical STM. We show the effect of industrially used additives, such as bis-(3-sodiumsulfopropyl) disulfide (SPS) and polyethylene glycol (PEG), on the Cu deposit. The EC-STM results are complemented by electrochemical measurements and discussed in the light of current state of knowledge on electrodeposition and molecular processes involving the additives.