Dresden 2011 – wissenschaftliches Programm
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Q: Fachverband Quantenoptik und Photonik
Q 15: Poster 1: Quanteninformation, Quanteneffekte, Laserentwicklung, Laseranwendungen, Ultrakurze Pulse, Photonik
Q 15.61: Poster
Montag, 14. März 2011, 16:30–19:30, P1
Laser-induced front side etching of fused silica with KrF excimer laser using thin metal layers — •Pierre Lorenz and Klaus Zimmer — Leibniz-Institut für Oberflächenmodifizierung e. V., Permoserstraße 15, 04318 Leipzig, Germany
Laser-induced front side etching is a method for laser etching of transparent materials using thin absorber layers. This approach is a straight forward advancement of the backside etching techniques. Within this study the etching of fused silica with different thin metal layers as absorbers is presented using nanosecond KrF excimer laser radiation (λ = 248 nm, 25 ns pulses, 10 Hz). The laser fluence, the number of pulses, the absorber material, as well as the layer thickness were varied. As metallic absorber materials chrome, aluminium, silver, titanium, as well as molybdenum were used with different layer thicknesses from 2 nm to 250 nm. Furthermore, the laser fluence was altered from below the metal ablation threshold up to 10 J/cm2 and the surface was processed with different pulse numbers up to 10 pulses. The treated fused silica was analysed with microscopic (white-light interferometry, scanning electron microscopy (SEM)) and spectroscopic methods (X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDX)). An etching depth up to 500 nm with well-defined etching regions can be achieved.