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Wuppertal 2015 – wissenschaftliches Programm

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T: Fachverband Teilchenphysik

T 43: Halbleiter: Belle, Germanium, Diamant

T 43.2: Vortrag

Dienstag, 10. März 2015, 17:00–17:15, G.10.05 (HS 7)

Test of the metallization of the EMCM for Belle II Pixel Detector — •Daniel Klose1, Ladislav Andricek1, Christian Koffmane1, Jelena Ninkovic1, Rainer Richter1, Florian Schopper1, Andreas Wassatsch1, Paola Avella2, Christian Kiesling2, Hans-Günther Moser2, Felix Müller2, and Manfred Valentan2 for the Belle II collaboration — 1Halbleiterlabor der Max-Planck-Gesellschaft, München, Deutschland — 2Max-Planck-Institut für Physik, München, Deutschland

In order to achieve excellent single point resolution and to keep multiple scattering at a minimum with low material budget, DEPFET sensors were chosen as inner two layers of the VXD (Vertex Detector) for the Belle II experiment. DEPFET sensors also offer a low power consumption and a high signal to noise ratio, even for thin sensors. The Electrical Multi-Chip Module (EMCM) was designed in the interest of studying especially the metal layer interconnectivity for the steering and regulation of the DEPFET matrix of the detectors for Belle II. The main goal of this study of the metal system is to get insights on the feasibility and reliability of the technology and collect information on its production yield. This study is done on wafer level. Specially designed test structures and testing strategies, developed to be able to identify all possible causes of reduction of the yield, will be presented. Finally results obtained from the optimized metallization technology will be shown.

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