Dresden 2017 – wissenschaftliches Programm
CPP 46.7: Vortrag
Mittwoch, 22. März 2017, 16:30–16:45, CHE 91
Ultra-robust thin film devices from metal-terpyridine wires — •Florian von Wrochem1, Maria Anita Rampi2, and Wolfgang Wenzel3 — 1Materials Science Laboratory, Stuttgart — 2Dipartimento di Chimica, Universita' di Ferrara — 3Institute of Nanotechnology, Karlsruhe Institute of Technology, Germany
Considerable efforts have been undertaken within the past decades to shift organic-based thin-film devices from basic research to the application level. A major hurdle is given by the thermal deposition of the metal electrodes, which remained elusive due to the damage and the electrical shorts experienced by the fragile molecular layers. Here, we show that large area molecular junctions of outstanding electronic properties and robustness can be realized using densely packed molecular wires consisting of FeII-terpyridine complex oligomers, despite a conventional fabrication process involving top electrode evaporation directly on the molecular layer. Surprisingly, these oligomer-based devices are stable for over 2 years under regular current-voltage cycling, withstanding a wide range of temperatures (150-360 K) and applied voltages (3 V). Electrical studies in conjunction with ab-initio calculations reveal that charge transport (i) occurs via electron (hopping) conduction and is limited by the charge injection through a Shottky barrier (0.72 eV), following Richardson-Schottky injection.