Dresden 2017 – wissenschaftliches Programm

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DF: Fachverband Dielektrische Festkörper

DF 13: SYNS - Symposium Nanostructuring Beyond Conventional Lithography
(MI with DS, DF, HL, MM and VA)

DF 13.5: Hauptvortrag

Mittwoch, 22. März 2017, 17:15–17:45, HSZ 02

High resolution 3D nanoimprint lithography — •Hartmut Hillmer — Institute of Nanostructure Technologies and Analytics (INA), University of Kassel, Germany

2D nanoimprint technologies have been widely investigated and are well established today, although huge research and development tasks have to be tackled in future since many scientific problems are not yet fully solved. In contrary, studies dealing with 3D nanoimprint technologies are still rare. This talk presents imprints of 3D structures:

1) 3D structures on substrates with very high spatial resolution in the vertical direction on substrates. Mesa arrays of laterally arbitrary shape with nominally perpendicular side walls towards the vertical direction have been fabricated by Substrate Conformal Imprint Lithography (SCIL). The height differences between the mesas are in the range of 2-3 nm and is some cases in the sub-nm range. These structures are embedded between Distributed Bragg Reflectors (DBRs) and define the cavities. These arrays of Fabry-Pérot Filters are applied as spectrometers. Since the entire different cavity heights are implemented by a single nanoimprint step, we label the device a nanospectrometer. The 3D templates have been fabricated using digital lithography. Applications of the imprinted nanospectrometer are demonstrated in food monitoring.

2) Released full 3D micro and 3D nano particles with arbitrary shape have been fabricated using our Self-Aligned NanoShaping (SANS) technology. The technological process involves a dual mold "waffle iron" principle. The novel SANS nanoimprint technology allows arbitrarily shaped 3D nanoparticles with precise size and shape control. Applications are intended in the field of pulmonal drug application in future.

References:

S. Schudy, M. Smolarczyk, H. Hillmer, N. Worpattrakul, F. Pilger, Patent application DE 10 2011 054 789.4