Dresden 2017 – wissenschaftliches Programm

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O: Fachverband Oberflächenphysik

O 63: Focus Session: Charge Transport at Surfaces and Nanostructures with Multi-probe Techniques

O 63.8: Poster

Dienstag, 21. März 2017, 18:30–20:30, P2-OG3

A six-tip AFM - SEM combination for semiconductor chip failure analysis — •Stefan Korte, Vasily Cherepanov, Richard Spiegelberg, Peter Coenen, and Bert Voigtländer — Peter Grünberg Institut (PGI-3), Forschungszentrum Jülich, 52425 Jülich, Germany, and JARA-Fundamentals of Future Information Technology

The structure size of modern semiconductor electronics is shrinking to dimensions where the electrical failure analysis of single components like transistors on a chip is hard to conduct. We developed a six-tip AFM combined with an SEM to contact single transistors on a chip with multiple tips. Its compact size reduces probe drifts to below 0.1 nm/min. This is necessary to create contacts stable enough for electrical measurements even on state-of-the-art semiconductor chips. Fast AFM scanning with FM-AFM using needle sensors and home-built fast PLL detection electronics is used to position the tips exactly on the contacts. In first trials we contacted single transistors of an SRAM cell on a chip built with 65 nm structure size for electrical characterization.