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DPG

Berlin 2018 – wissenschaftliches Programm

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DS: Fachverband Dünne Schichten

DS 23: Lithography II: Focused Electron Beam Induced Processing: 3D Nano-Printing for Material Science (Focussed Session): Afternoon Session (joint session DS/KFM)

DS 23.6: Vortrag

Mittwoch, 14. März 2018, 16:15–16:30, H 2032

Exploring new copper complexes for FEBID — •Luisa Berger1, Katarzyna Madajska2, Nils Boysen3, Iwona Barbara Szymánska2, Anjana Devi3, and Ivo Utke11Empa - Swiss Federal Laboratories for Materials Science and Technology, Thun, Switzerland — 2Nicolaus Copernicus University, Torun, Poland — 3Ruhr-Universität Bochum, Germany

Focused electron beam induced deposition (FEBID) is a well-established maskless direct write method for nanostructures [1]. The deposition of pure copper with FEBID has not been achieved so far and metal contents typically reached 13-25 at.% [2]. By exploring novel copper precursor classes - fluorinated copper carboxylates ([Cu2(u-O2CC2F5)4], [Cu2(EtNH2)2(u-O2CC2F5)4]) and a fluorine-free β-diketonate (Cu(tbaoac)2) - we intend to achieve the deposition of high purity structures. The latter was employed in FEBID recently [3] while carboxylates were reported as CVD precursors [4]. The influence of varying deposition parameters on appearance and composition was investigated. First interesting results lead to copper contents of 25 at.%.

[1] I. Utke, A. Gölzhäuser, Angew. Chem. Int. Ed. 49 (2010), 9328.

[2] A. Luisier et al., Journal of The Electrochemical Society, 151 (2004) C535.

[3] C. Haverkamp, K. Höflich et al., Beilstein Journal of Nanotechnology 2017 (in review)

[4] P. Piszczek, I. B. Szymańska, Chem. Vap. Deposition, 19 (2013) 251.

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