Erlangen 2018 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

K: Fachverband Kurzzeit- und angewandte Laserphysik

K 6: Poster

K 6.2: Poster

Mittwoch, 7. März 2018, 16:15–18:15, Orangerie

Laser processing of silicon suboxide for the fabrication of diffractive phase elements — •Lukas Janos Richter, Clemens Beckmann, Jörg Meinertz, and Jürgen Ihlemann — Laser-Laboratorium Göttingen e.V., Hans-Adolf-Krebs-Weg 1, 37077 Göttingen

Matierals processing by UV excimer laser ablation offers fast and flexible ways for microfabrication. A prerequisite for precise patterning is strong absorption in the UV regime. In contrast to UV-transparent fused silica (SiO₂), silicon suboxide (SiO_x, x<2) is absorbing in the UV and can be machined with high precision. By thermal treatment the silicon suboxide can subsequently be oxidised to fused silica. This two step process allows for the fabrication of microstructured components made entierly of fused silica. E. g., diffractive optical elements with two phase-quantized levels (binary DOEs) can be produced via rear-side ablation of a thin film of silicon suboxide on a fused silica substrate [1]. In a next step a multilevel structure is produced by repeating the steps of ablation and oxidation after recoating the surface with silicon suboxide.
Fricke-Begemann et al., Applied Physics A 117:13-18 (2014)