München 2019 – scientific programme

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HK: Fachverband Physik der Hadronen und Kerne

HK 8: Instrumentation II

HK 8.4: Talk

Monday, March 18, 2019, 14:45–15:00, HS 12

High-density interconnection technologies for the CBM Silicon Tracking System — •Patrick Pfistner¹, Thomas Blank¹, Michele Caselle¹, Marc Weber¹, Johann Heuser², Christian J. Schmidt², Carmen Simons², and Robert Visinka² for the CBM collaboration — ¹KIT, 76344 Eggenstein-Leopoldshafen, Deutschland — ²GSI, 64291 Darmstadt, Deutschland

The double-sided silicon microstrip sensors of the Silicon Tracking System (STS) of the Compressed Baryonic Matter (CBM) experiment at FAIR, GSI are connected to the read-out electronics by low mass flexible microcables due to tight material budget restrictions. The cable length of up to 50 cm and its flexible nature make detector module assembly one of the most critical parts in STS. The established interconnection technology for the modules is aluminum - aluminum TAB bonding. While the TAB bonding technology provides a reliable interconnection between cable and die, the module production will be a highly manual and thus time-consuming procedure. Therefore, an additional interconnection technology is being developed based on a double-layered copper microcable. This microcable allows for a novel flip-chip detector production method based on high-density gold-stud bumping on the silicon die and fine-grain solder paste printing on the microcable. We present both the TAB bonding and the novel flip-chip production method together with the design and characterization of the developed copper microcable.