Regensburg 2019 – scientific programme

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CPP: Fachverband Chemische Physik und Polymerphysik

CPP 25: Poster Session II

CPP 25.14: Poster

Tuesday, April 2, 2019, 14:00–16:00, Poster B1

Thermo-mechanical behavior of silver-filled thermoplastic polymers — •Amira Baccari and Peter Müller-Buschbaum — TU München, Physik Department, LS Funktionelle Materialien, 85748 Garching, Germany

Filled thermosetting and thermoplastic polymers are used for silver-filled, electrically conductive adhesives in the printed circuit board industry. These are a type of glue containing usually 80% of a conductive material and 20% of a polymer matrix that has the necessary mechanical and thermal properties. The produced electronic devices need to pass several thermo-mechanical tests using dynamic mechanical analysis and thermal mechanical analysis (DMA and TMA) techniques in order to get a good expectancy of the lifetime performance and behavior of the products. Companies concerned with the manufacturing of electronics want to use experiments and simulation for assessing a new adhesive based on a thermoplastic polymer matrix (instead of the usual epoxy-based composite adhesive). Thermo-mechanical material models of polymers are essential for obtaining meaningful results from thermo-mechanical simulation. The electronics packaging community has an acceptable understanding of the thermo-mechanical behavior of thermosetting epoxy polymers, but not yet of silver-filled thermoplastic polymer matrices, which will be focused in this work.