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Regensburg 2019 – scientific programme

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HL: Fachverband Halbleiterphysik

HL 45: HL Posters III

HL 45.43: Poster

Thursday, April 4, 2019, 18:30–21:00, Poster E

Hybrid Assembly of Elements for Quantum Networks — •Andreas W. Schell — Quantum Optical Technology Group, CEITEC, Brno, Czech Republic

Bringing quantum technology from the laboratory to real world applications is a complex, but very rewarding, task. It will enable society to exploit the new opportunities the laws of quantum mechanics offer compared to purely classical physics. However, before the new quantum technology can be deployed, platforms to implement such a technology need to be discovered and developed. Here, we will show our ongoing efforts to implement such a platform using the so called hybrid approach for the assembly of quantum photonic elements. In the hybrid assembly approach, structures and emitters from different materials are combined in order to exploit the specific strength of the individual material while avoiding possible disadvantages by use of complementary other materials. This approach is highly flexible and can be adapted to many different material systems and structures. In particular, we will introduce techniques based on scanning probe microscopy and three-dimensional laser writing. Assembled systems include emitter coupled to on-chip resonators and waveguides, different kinds of fiber integrated cavities, and incorporate a variety of emitter such as NV centers, quantum dots, and defects in two-dimensional materials, such as hexagonal boron nitride. From these examples it can be seen that photonics elements assembled using hybrid techniques might help to facilitate the transition of quantum photonic networks out of lab to real-world applications.

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