Dresden 2020 – scientific programme

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TT: Fachverband Tiefe Temperaturen

TT 60: Cryotechnique: Refrigeration and Thermometry

TT 60.6: Talk

Thursday, March 19, 2020, 16:15–16:30, HSZ 103

Chip-based calorimeter for micro- and nanostructures — •Julian Litzel, Sebastian Kölsch, Fabrizio Porrati, and Michael Huth — Institute of Physics, Goethe University, Max-von-Laue-Str. 1, Frankfurt am Main 60438, Germany

Recently, direct-write nanofabrication by focused electron or ion beam induced deposition (FEBID/FIBID) has gained significance in various areas of solid state physics and materials science [1]. Single or multi-component ferromagnetic, superconducting and granular electronic micro- and nanostructures can now be fabricated routinely at a lateral resolution that rivals advanced electron beam lithography but also allows the creation of complex three-dimensional nano-architectures. Due to the small size of these structures, standard techniques for heat capacity measurements cannot be applied.

We are developing a turn-chip based platform for heat-pulse calorimetry that uses a thin SiN_x membrane onto which the heater element and thermometer are deposited by applying direct-writing techniques. This membrane then serves as the platform for the material whose heat capacity is measured. We present the chip design and show first results.

[1] M. Huth, F. Porrati, O. V. Dobrovolskiy, Microelectronic Engineering, 185 - 186, 9 (2018)