DPG Phi
Verhandlungen
Verhandlungen
DPG

SKM 2021 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

HL: Fachverband Halbleiterphysik

HL 19: Poster Session IV

HL 19.27: Poster

Donnerstag, 30. September 2021, 13:30–16:30, P

Contact Preparation and Thermoelectric Properties of Bismuth Nanowires — •Mahni Müller1, Rüdiger Mitdank1, Hoda Moosavi2, Michael Kröner2, Peter Woias2, Jeongmin Kim3, Wooyoung Lee3, Adnan Hammoud4, Thomas Lunkenbein4, and Saskia Fischer11Novel Materials Group, Humboldt-Universität zu Berlin, 10099 Berlin, Germany — 2Laboratory of Design of Microsystems, University of Freiburg, IMTEK, 79110 Freiburg, Germany — 3Department of Material Science and Engineering, Yonsei University, 03722 Seoul, Repuplic of Korea — 4Fritz Haber Institute of the Max Planck Society, 14195 Berlin, Germany

Bismuth-based thermoelectric materials have always been promising for improving the thermoelectric figure of merit [1]. Those properties can strongly be modified through nanostructuring and additionally a high surface-to-volume-ratio is obtained with nanowires [2].

However, due to air exposure, a native oxide shell forms around the bismuth core, which leads to non-ohmic contact resistances. To achieve ohmic contacts for low temperature measurements, we present a preparation method with focused-ion-beam-induced deposition (fibid). Measurements of the electrical and thermal conductivity and of the Seebeck coefficient of bismuth nanowires with fibid-contacts between 10 K and 300 K were performed and compared to bulk. We discuss the change in properties and the possible influence of the contacting method.

[1] M. S. Dresselhaus et al., Phys. Solid State 41, 679-682 (1999).

[2] T. E. Huber et al., Phys. Rev. B 83, 2354414 (2011).

100% | Mobil-Ansicht | English Version | Kontakt/Impressum/Datenschutz
DPG-Physik > DPG-Verhandlungen > 2021 > SKM