Parts | Days | Selection | Search | Updates | Downloads | Help

KFM: Fachverband Kristalline Festkörper und deren Mikrostruktur

KFM 7: Focus: High-resolution Lithography and 3D Patterning

KFM 7.1: Invited Talk

Wednesday, March 29, 2023, 09:00–09:30, POT 51

Novel device integration -- combining bottom-up and topdown approaches — •Artur Erbe — Helmholtz-Zentrum Dresden-Rossendorf, Dresden, Germany — TU Dresden, Germany

Scaling electronic devices to smallest structure sizes well below 10nm will require novel developments for the fabrication of single components. Smallest functional devices can be assembled using chemical methods leading to, e.g., single molecules with electronic functionalities. Reliable contacting of single molecules using metallic contacts is, however, an extremely challenging task that has not been solved so far. We have therefore developed techniques that use self-assembly to create conducting nanostructures to create small, self-assembled circuits that can then be contacted reliably using standard lithographic methods. In this talk, we will show how DNA Origamis can be used for the self-assembly of metallic nanowires, which are contacted using electron beam lithography and electrically characterized. Self-assembly can be used to integrate semiconducting nanoparticles or single molecules for building nanodevices. Further integration of such nanostructures into standard silicon electronics may for example be achieved by connecting these nanodevices to silicon nanowires or transistors based on 2-dimensional materials. We have therefore developed reconfigurable transistors based on these materials using electron beam lithography and further processing (i.e. using a classical top-down approach), which are reconfigurable. With the combination of these transistors with self-assembled nanostructures, a large variety of electronic nanocircuits can be constructed in future applications.