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KFM: Fachverband Kristalline Festkörper und deren Mikrostruktur

KFM 7: Focus: High-resolution Lithography and 3D Patterning

KFM 7.6: Invited Talk

Wednesday, March 29, 2023, 11:05–11:35, POT 51

4D meso-scale electronics for next generation medical tools and electronic skins — •Daniil Karnauschenko — Research Center MAIN, Technical University Chemnitz, Rosenbergstr. 6, 09126 Chemnitz, Germany

State-of-art mesoscale systems for IoT, e-skins or smart-dust applications, medical or commercial products are essentially 3D architectures, whose geometry plays vital role when providing communication, sensing, actuation and power management functions. Conventional components carrying electronic functions are static, functionally heterogeneous and spatially separated requiring nontrivial sequential assembly and packaging procedures, which hinder further miniaturization and development of next generation mesoscale systems. 3D self-assembled architectures are envisioned to become a driving force for 3D electronic devices designed, microfabricated and self-assembled from planar thin-film structures and self-organized electronic components. Dynamic (4D) parallel assembly operating at mesoscale (1 um - 1 mm) allows offers improved performance while reducing overall manufacturing complexity of devices and components by harnessing the relative ease in which it can produce mesoscopic 3D geometries i.e. origami folded structures and "Swiss-roll" architectures. These architectures and benefits will lead to tighter a system integration e.g. electronic skins and medical tools made out of electronic components including active matrix, capacitors, power sources, coils, sensors, actuators and antennas with reduced costs fabricated from a single wafer.