DPG Phi
Verhandlungen
Verhandlungen
DPG

SKM 2023 – wissenschaftliches Programm

Bereiche | Tage | Auswahl | Suche | Aktualisierungen | Downloads | Hilfe

MM: Fachverband Metall- und Materialphysik

MM 12: Poster I

MM 12.6: Poster

Montag, 27. März 2023, 18:15–20:00, P2/OG1+2

Investigations on thermal contact conductance between filled polymer composites and solids using micro thermography — •Oliver Roser1,2, Andreas Griesinger3, and Othmar Marti21Center for Heat Management (ZFW), Stuttgart — 2Institute of Experimental Physics, Ulm University — 3Baden-Wuerttemberg Cooperative State University (DHBW) Stuttgart

When optimizing cooling paths in electronic devices, thermal interface materials (TIMs) are used to optimize the thermal transfer between two solid surfaces. TIMs are thermally conductive filled polymer composites with a complex microstructure. We investigated the intrinsic thermal conductivity of TIMs and the thermal contact conductance between TIMs and solid substrate surfaces using micro thermography. The physical principles of thermal transport when considering this kind of contact have not yet been investigated in detail and just a few experimental results are available. Most common measurement techniques determine a macroscopic conductance. Random surface and filler structures however, cause several variations and some specific effects on contact conductance, which need to be investigated on a microscale. With the utilized IR camera system, we can take pictures with a resolution of down to 14 microns per pixel. The new method allows us to analyze the microscopic heat paths on the particle scale and to understand the physical principles of heat transport in contact zones of TIMs. The main parameters which affect the contact conductance were identified and will be presented in addition to comparisons to other measurement methods, and a microscale simulation approach.

100% | Mobil-Ansicht | English Version | Kontakt/Impressum/Datenschutz
DPG-Physik > DPG-Verhandlungen > 2023 > SKM