SKM 2023 – wissenschaftliches Programm

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TT: Fachverband Tiefe Temperaturen

TT 58: Poster: Superconductivity II

TT 58.11: Poster

Donnerstag, 30. März 2023, 15:00–18:00, P2/OG3

3D-Integration of superconducting qubits using flip-chip bump bonding technology — •Franziska Wilfinger^1,2, Ivan Tsitsilin^1,3, and Stefan Filipp^1,2,3 — ¹Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, Garching, Germany — ²Physik Department, Technische Universität München, Garching, Germany — ³Munich Center for Quantum Science and Technologies (MCQST), Munich, Germany

Superconducting quantum circuits are typically realized in a planar architecture. This approach is, however limited to dozens of qubits due to the complexity of routing signal lines when scaling beyond. 3D-integration can overcome these limitations by separating circuit components on different layers and on different chips. One promising 3D-integration strategy is to assemble two chips, patterned on one side, through flip-chip bonding using indium bumps. Quantum components such as qubits and couplers containing Josephson junctions can then be separated from the control- and readout-lines on different faces. Here, we discuss design concepts and test-structures in a flip-chip architecture and their simulated performances with respect to quality factors, decay rates and gate times. Finite-element simulation is applied to extract design parameters such as the qubit coupling to readout- and control lines and to other qubits. These parameters are optimized in order to achieve a performance comparable with planar structures. Moreover, the influence of inaccuracies in fabrication is investigated by simulating varying distance parameters and analyzing their impact on relevant quantities.