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DS: Fachverband Dünne Schichten

DS 20: Poster

DS 20.28: Poster

Thursday, March 12, 2026, 18:30–20:30, P2

Towards Low-Temperature ALD of Topological Insulator Sb2Te3 — •Luise Merkwitz1,2, Paul Pöhler1,2, Steffen Ziller1, Knut Ulbrich1, Marek Ulbrich1, Sebastian Lehmann1, and Kornelius Nielsch1,21Institute for Metallic Materials, Leibniz Institute for Solid State and Materials Research, IFW Dresden, D-01069 Dresden, Germany — 2Technical University Dresden, D-01069 Dresden, Germany

Low-Temperature ALD expands the range of applications for ALD enabling not only the deposition of thin films on temperature-sensitive substrates but also the possibility of a more ressoure-efficient setup and reaching advantages in material conformity and less sample defects.

We have designed, constructed and developed a state-of-the-art Low-Temperature ALD reactor for high-quality thin films. Our previous results demonstrate the technical functionality and reproducibility of known Low-Temperature ALD processes. In addition, our latest results reveal a never before published Sb2Te3 synthesis which we consider to be a highly promising Room-Temperature ALD process.

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