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QI: Fachverband Quanteninformation

QI 11: Implementations IV

QI 11.6: Vortrag

Mittwoch, 11. März 2026, 11:30–11:45, BEY/0245

High-Coherence Superconducting Qubits on Wafer-Scale — •Julius Feigl1, 2, Niklas Bruckmoser1, 2, Leon M. Koch1, 2, 3, David Bunch1, 2, Léa Richard1, 2, Christian Gnandt1, 2, Ivan Tsitsilin1, 2, 3, Anirban Bhattacharjee1, 2, Haiyang Hu1, 2, Vera P. Bader1, 2, Lasse Södergren1, 2, and Stefan Filipp1, 21Technical University of Munich, TUM School of Natural Sciences, Physics Department, Garching, Germany — 2Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, Garching, Germany — 3Peak Quantum GmbH, Garching, Germany

Scaling superconducting quantum processors requires fabrication processes that maintain high qubit coherence across increasingly complex multi-qubit chips. While substantial progress has been achieved for isolated, single-qubit devices, preserving these coherence levels in multi-qubit architectures remains challenging due to added fabrication steps and potential loss mechanisms. In particular, as system performance is frequently limited by the least coherent qubit, understanding coherence variations across a wafer is crucial. Therefore, we present coherence measurements from twelve transmon qubits across two chips fabricated on a 100 mm wafer. The qubits exhibit an average relaxation time of T1 = 236 ± 14 µs, with the lowest device having a relaxation time of 111 ± 30 µs. We further examine the influence of fabrication processes required for large-scale integration, such as air bridges and indium bumps, on coherence. These lead to a reduction in coherence time, providing insight into the impact of additional processing required for large-scale superconducting quantum processors.

Keywords: Superconducting Qubits; Fabrication

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DPG-Physik > DPG-Verhandlungen > 2026 > Dresden