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TT: Fachverband Tiefe Temperaturen
TT 73: Superconductivity: Tunneling and Josephson Junctions
TT 73.11: Vortrag
Donnerstag, 12. März 2026, 12:15–12:30, CHE/0089
Preserving the Josephson coupling of twisted cuprate junctions via tailored silicon nitride circuits boards — •Tommaso Confalone1,2, Kornelius Nielsch1,2, Golam Haider1, and Nicola Poccia1,3 — 1IFW Dresden — 2TU Dresden — 3U. Naples
The fabrication of van der Waals (vdW) Josephson junctions (JJs) using the cuprate superconductor Bi2Sr2CaCu2O8+δ (BSCCO) remains limited by the material’s extreme sensitivity to heat and chemical processing, which hinders the integration of high-quality junctions into functional device architectures. Although the cryogenic stacking technique (CST) has enabled atomically sharp BSCCO interfaces with preserved superconducting properties [1], conventional CST-based devices rely on post-assembly contacting strategies that degrade junction performance or restrict circuit complexity. Here, we present a CST-compatible contact scheme in which electrodes embedded in a silicon nitride membrane are directly transferred onto the BSCCO junction during assembly [2]. This membrane-based transfer eliminates high-temperature or chemically aggressive steps and preserves interface integrity. Using this approach, we realize twisted BSCCO JJs exhibiting the strongest Josephson coupling reported to date. The technique is fully compatible with ultra-high-vacuum (UHV) environments, enabling integration with emerging UHV-based vdW fabrication platforms. These results underscore the critical role of contact engineering and open the path for exploring the fundamental properties of these devices.
[1] Science 382,1422 (2023)
[2] Small e06520 (2025)
Keywords: cuprate superconductors; twisted van der Waals heterostructures; silicon nitride membranes; Josephson junctions; circuits integration