Dresden 2003 – wissenschaftliches Programm
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CPP: Chemische Physik und Polymerphysik
CPP 22: POSTER C
CPP 22.42: Poster
Donnerstag, 27. März 2003, 12:00–14:00, ZEU/250
Wetting behavior of thin polymer films on rough silicon substrates — •P. Volodin1, P. Müller-Buschbaum2, and M. Stamm1 — 1IPF Dresden, Hohe Str. 6, 01069 Dresden — 2TU München Physik Department LS E13, James-Franck-Str.1, 85747 Garching
Recent studies are focused on the dewetting process of thin films on physically and chemically heterogeneous substrates. Here, we present some preliminary results on the stability of polystyrene films on rough surfaces. We investigate the stability of thermodynamically meta-stable 25-35 nm thick polystyrene films on chemically roughened silicon during annealing. RMS roughness of the etched substrates is the in range of 0.5 to 70 nm on 25x25 µm2 lateral scale. The behavior of the polymer films is monitored by AFM and GISAXS techniques. After spin coating, the polystyrene film is smoother as compared to the substrate surface, which is covered by this film. During annealing, the polystyrene surface appears to become even smoother. The polystyrene film remains stable on rough silicon substrates with the RMS roughnesses up to approximately 20 nm. In case of a larger surface roughnesses the film profiles exhibit sharp features which correspond to substrate elevations. We suppose that this elevations are covered by a polystyrene film of reduced thickness.