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DPG

Berlin 2008 – wissenschaftliches Programm

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O: Fachverband Oberflächenphysik

O 18: Poster Session I - MA 141/144 (Atomic Wires; Size-Selected Clusters; Nanostructures; Metal Substrates: Clean Surfaces+Adsorption of Organic / Bio Molecules+Solid-Liquid Interfaces+Adsorption of O and/or H; Surface or Interface Magnetism; Oxides and Insulators: Clean Surfaces)

O 18.33: Poster

Montag, 25. Februar 2008, 18:30–19:30, Poster F

High-Density Zig-Zag Dimer-Chain of Trimesic Acid at Graphite-Phenyloctane InterfaceHa N. T. Nguyen1,3, •Thiruvancheril G. Gopakumar1, Markus Lackinger2, and Michael Hietschold11Institute of Physics, Solid Surfaces Analysis Group, Chemnitz University of Technology, D-09107, Chemnitz, Germany. — 2Institute of Crystallography and Applied Mineralogy, Ludwig-Maximilians-University Munich, Munich, Germany. — 3Department of Applied Physics, Faculty of Physics ,University of Natural Science, 227 Nguyen Van Cu, Hochiminh city, Viet Nam.

Trimesic acid (TMA) is well known for its self-assembly via hydrogen bonding, especially in fatty acids at solid-liquid interface. The well known open structures are the planar chicken wire and flower structures[1]. It has never been observed for TMA in any of the studied solvents a high density structure with molecules adsorbing parallel to the substrate at solid-liquid interface. We have observed a stable adsorption of TMA in phenyloctane (C14H22), a non-polar solvent, with high packing density at room temperature. The packing density is 1.3 molecules/nm2, which is the highest observed for any of planar adsorption of TMA structures at solid-liquid interface. The molecules interact through the carboxylic functional groups with a dimer motif leading to dimer-chain. In adjacent rows the molecules have inverted symmetry (3-fold), which provides the molecules to interact and close pack themselves in a zig-zag fashion. The high density is expected due to high concentration of TMA in phenyloctane by sonication.

[1] Markus Lackinger, et al., Langmuir 2005, 21, 4984-4988.

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