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Verhandlungen
Verhandlungen
DPG

Berlin 2008 – wissenschaftliches Programm

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O: Fachverband Oberflächenphysik

O 55: Poster Session III - MA 141/144 (Methods: Atomic and Electronic Structure; Particles and Clusters; Heterogeneous Catalysis; Semiconductor Substrates: Epitaxy and Growth+Adsorption+Clean Surfaces+Solid-Liquid Interfaces; Oxides and Insulators: Solid-Liquid Interfaces+Epitaxy and Growth; Phase Transitions; Metal Substrates: Adsorption of Inorganic Molecules+Epitaxy and Growth; Surface Chemical Reactions; Bimetallic Nanosystems: Tuning Physical and Chemical Properties; Oxides and insulators: Adsorption; Organic, polymeric, biomolecular films; etc.)

O 55.33: Poster

Mittwoch, 27. Februar 2008, 18:30–19:30, Poster F

Interfacial layering of room temperature ionic liquids based on the tris(pentafluoroethyl)trifluorophosphate anion at the sapphire interfaces — •Markus Mezger1, Heiko Schröder1, Sebastian Schramm1, Harald Reichert1, Sebastian Schöder1, John Okasinski1, Moshe Deutsch2, Benjamin Ocko3, Emerson De Souza1, John Ralston4, and Helmut Dosch11Max-Planck-Institut für Metallforschung, Stuttgart — 2Bar-Ilan University, Ramat-Gan, Israel — 3Brookhaven National Laboratory, Upton, NY, USA — 4Ian Wark Research Institute, Adelaide, Australia

A new group of room temperature ionic liquids (RTIL) based on the tris(pentafluoroethyl)trifluorophosphate (FAP) anion reveals intriguing features in comparison to conventional molten salts. Especially the improved chemical and thermal stability make them interesting candidates for a variety of technological processes. Using high energy x-ray reflectivity we get access to deeply buried solid-liquid interfaces and gain real space information with Å-resolution. In this study, we discuss reflection patterns of FAP based ionic liquids, recorded at different temperatures ranging from the highly supercooled metastable liquid state to 120   C. By parameter refinement of a two-component distorted-crystal model we disclose pronounced layering of the anions and cations close to the solid wall. With increasing temperature, the decay length of the interfacial ordering decreases.

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